Thermal ezpansion coefficient and electrical resistivity of nonuniform temperature specimen

摘要：

A new computing method is proposed for the measurement of the thermalphysical parameters of specimens with nonuniform temperature profile distributions. The calculation method is derived from the temperature dependence of the thermal properties, and can be applied to the measurement of the longitudinal thermal expansion coefficient and electrical resistivity. The cross section of the entire specimen is uniform at room temperature and the changes during the experiments are ignored in this method. If the temperatures are measured at equal intervals, the specimen may be considered as consisting of M equal segments and each of them is S long. The corresponding length and resistance of these segments at temperature T0 may be of any value. If the changes in length and temperature distribution of the specimen are measured, the temperature dependence of the thermal expansion coefficient can be worked out using this method. If the resistance and temperature distribution of the specimen are measured, the electrical resistivity versus temperature function of the specimen, which is corrected by thermal expansion, can be obtained as well. The validity of the computing method of thermal expansion coefficient and electrical resistivity is verified through computer simulation. The maximum ‘measurement error of electrical resistivity is 3.3％.

关键词： Thermalphysical properties thermal ezpansion coefficient electrical resistivity nonuniform temperature

作者: Chunsuo Xin Jingmin Dai Qiang Wang Xiaowa He

作者单位: Dept. of Automation Measurement & Control, Harbin Institute of Technology, Heilongjiang,Harbin, 1500 Aerospace Research Institute of Materials and Processing Technology, Beijing 9200 - 73 – 15, 100076

会议类型: 国际会议

会议名称: 第五届仪器科学与技术国际学术会议(ISIST 2008)Fifth International Symposium on Instrmentation Science and Technology

会议地点: 沈阳

会议语种:英文

页码: 1-7

在线出版日期: 2008-09-15（万方平台首次上网日期，不代表论文的发表时间）