Simulation of Filling Characteristics during Hot Embossing of Polymer Microstructures

摘要：

Hot embossing is an effective way to achieve high-quality Microstructures at low cost. At present papers, the effects of geometry and shear on filling profile and polymer deformation have studied through experiments or computations. In this paper, the parameters on different polymer deformation modes: single peak, dual peak and embossing stage have researched. Especially it is referred that the mainly reasons of embossing stage phenomenon are the ratio of cavity width to height 2w/hi, the ratio of cavity width to tool width w/(w+s), and shear thinning. In addition, the temperature variation of polymer due to internal friction has discussed with evolution of imprint speed. And the simulation results prove a better coincidence with experiments.

关键词： stamp geometry shear thinning temperature dependence polymer deformation

作者: Peng JIN Yulong GAO Tingting LIU

作者单位: Research Center of Ultra-precision Optoelectronic Instrumentation, Harbin Institute of Technology,Ha Research Center of Ultra-precision Optoelectronic Instrumentation, Harbin Institute of Technology, H

会议类型: 国际会议

会议名称: 第五届仪器科学与技术国际学术会议(ISIST 2008)Fifth International Symposium on Instrmentation Science and Technology

会议地点: 沈阳

会议语种:英文

页码: 1-6

在线出版日期: 2008-09-15（万方平台首次上网日期，不代表论文的发表时间）