STUDY ON THE MACHINING PROCESS OF A NEW LASER CRACK-FREE CUTTING TECHNIQUE FOR CERAMICS
This paper presents initial research results of a new laser crack-free cutting technique, which be capable of cutting ceramics with thickness of ≥ 10 mm in internal straight or curve trajectory by CO2 laser at higher cutting speed of about 25～30 mm/min. The technique is originated from the laser continuous piercing full through the workpieces but need appropriate time shot for every piercing and adaptation on processing steps, cycle duty and gas pressure and so on. With low frequency of 30~50 Hz, low duty cycle of 20~50％, piercing time of 0.1~0.5 s and piercing pitch of about 0.03~0.05 mm in pulse mode operation, crack-free laser cutting of ceramics can be achieved. By the study on Al2O3 and SiC ceramics with different thickness and density, it was concluded that the new laser crackfree cutting technique can be a feasible tool for successful cutting of ceramics in complex path, even for 3D cutting.
Lingfei Ji Yong Bao Yinzhou Yan Yijian Jiang
Institute of Laser Engineering, Beijing University of Technology, Beijing 100022, P. R. China
国际会议
第三届太平洋国际激光与光学应用会议(PICALO 2008)
北京
英文
28-32
2008-04-16（万方平台首次上网日期，不代表论文的发表时间）