ND:YAG LASER AND MICROPEN INTEGRATED FABRICATION OF MIM THICK FILM CAPACITORS
With rapid development of the electronic industry, how to respond the market requests quickly, shorten R&D prototyping fabrication period, and reduce the cost of the electronic devices have become a challenge work, which need flexible manufacturing methods. In this work, two direct-write processing methods, i.e. direct material deposition by micropen and Nd:YAG laser micro cladding, are integrated with CAD/CAM technology for the hybrid fabrication of passive electronic components. Especially, the Metal-Insulator-Metal (MIM) type thick film capacitors are fabricated on ceramic substrates by this method. A basic two-step procedure of laser micro cladding electronic pastes (LMCEP) process for the thick film pattern preparation is presented. Multilayer structure and properties are demonstrated and discussed. The results of the frequency characteristics test show the MIM thick film capacitors fabricated by the LMCEP process have good DC voltage stability, good frequency stability and low dissipation factor.
Yu Cao Xiangyou Li Xiaoyan Zeng
Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology Wuhan, Hubei, 430074, P.R.China
国际会议
第三届太平洋国际激光与光学应用会议(PICALO 2008)
北京
英文
703-708
2008-04-16（万方平台首次上网日期，不代表论文的发表时间）