FLASH LAMP CURING OF NANO-PARTICULATES FOR PASSIVE DEVICE FABRICATION
Photonic Curing is being developed to cure or sinter metal nano-particle based films by exposing them to brief, intense pulse of light from a xenon flash lamp. This photonic curing technology allows for rapid and selective heating that fuses nano-scale metallic ink particles into functional components. This technology allows the curing or sintering of nanoscale metallic ink patterns on low-temperature substrates including flexible circuit boards, flat panel displays, interconnects, RFID tags, and other disposable electronics without the use of heat. This paper reports on the results obtained after sintering conductive, magnetic, and dielectric nano-particle inks. Sintering was performed with the photonic curing technique developed by NovaCentrix, 2W frequency doubled Nd:YAG CW laser, and a conventional muffle furnace. Sample thickness, micro-structural details, resistivity, and sintering characteristics are also examined and compared for the three sintering techniques.
James Sears Michael Carter Jeffery West
Additive Manufacturing Laboratory, South Dakota School of Mines and Technology 501 E. St. Joseph St., Rapid City, SD 57701 USA
国际会议
第三届太平洋国际激光与光学应用会议(PICALO 2008)
北京
英文
819-824
2008-04-16（万方平台首次上网日期，不代表论文的发表时间）