AN INVESTIGATION OF CUTTING POLYCRYSTALLINE DIAMOND USING 355NM UV PULSE LASER
Polycrystalline diamond (PCD) is extensively used as cutting tool in machining hard-to-machine materials for its excellence performance such as hardness, toughness and wear resistance. However, it cannot or is hard to machine by traditional techniques. As laser material removal is an effective processing technique for hard materials a frequency tripled Nd:YAG laser (λ=355nm，Pmax=10W, FWHM=15ns, M2<1.2) was employed to process the PCD in this paper. The physical mechanisms of laser-matter machining and the influence of different laser parameters on the laser cutting of PCD were discussed and PCD film as thin as 40μm was obtained by laser cutting. The breakdown threshold was also measured with the nanosecond laser. After cutting, optical microscope, scanning electron microscopy, Energy Dispersive X-ray detector, Micro-Raman spectroscopy and 3D surface measure instrument were used to analyze the microstructure, particle-size, different elements transformation and the roughness of the cutting surface.
Libin Zhai Jimin Chen Maohua Jiang Hongliang Zhao Chunyu Sun
National Center of Laser Technology, Beijing University of Technology, Beijing 100022, China Beijing Beidou Diamond Tool Co. Beijing, China
国际会议
第三届太平洋国际激光与光学应用会议(PICALO 2008)
北京
英文
899-904
2008-04-16（万方平台首次上网日期，不代表论文的发表时间）