Finite Element Method Simulation of Photoinductive Imaging for Cracks
In this paper, the numerical simulations of photoinductive imaging (PI) method have been performed using the finite element method (FEM) with the 2D transient to characterize corner cracks at the edge of a bolt hole. The PI imaging results have higher spatial resolution in the area of the defect in 2D models as compared with the conventional eddy current (EC) images. The FEM simulation results of 0.5-mm rectangular defects are showed and analyzed. The dependencies of PI signals on EC frequencies and temperature of the thermal spot are also examined. The results demonstrate that the PI method is applicable to examine the geometric shape of corner cracks.
Cheng-Chi Tai Yen-Lin Pan
Department of Electrical Engineering,National Cheng Kung University,Tainan,Taiwan
国际会议
Progress in Electromagnetics Research Symposium 2008(2008年电磁学研究新进展学术研讨会)(PIERS 2008)
杭州
英文
1-5
2008-03-24（万方平台首次上网日期，不代表论文的发表时间）