Verification of BGA Package in RF Application

摘要：

The characteristics of BGA allow for higher pin counts, higher effectrical and thermal performance and higher interconnect density; can meet the specifications of the next generation wireless communication systems, especially the use in RF module. In this paper I will verify the effectrical performance of the BGA.

作者: Zhihong Dong Zhiping Yu

作者单位: The Institute of Microelectronics of Tsinghua University, China

会议类型: 国际会议

会议名称: Progress in Electromagnetics Research Symposium 2007(2007年电磁学研究新进展学术研讨会)(PIERS 2007)

会议地点: 北京

会议语种:英文

页码: 234-236

在线出版日期: 2007-03-26（万方平台首次上网日期，不代表论文的发表时间）