A LTCC Power Amplifier for a Ku-band Transmitter Module
A power amplifier utilizing multilayer Low temperature co-fired ceramic (LTCC) substrates for a Ku-band transmitter module is presented. The disposition of the thru-plane thermal vias for heat dissipation is analyzed and the heat spreading capability of the entire substrate is calculated. A full passive model of the power amplifier is proposed and simulation in a full-wave EM solver is performed. The power amplifier shows a measured gain of 30.4dB and a 1dB compression output power of 28.2dBm at 16GHz. Good agreement between the simulated and measured results was achieved. The measured results validate the accuracy of the passive model. RF-unfriendly DC lines for the power amplifier in a transmitter module are proposed for future use.
power amplifier LTCC via arrays heat dissipation DC lines RF- unfriendly
Jianhua Ji Yinqiao Li Jianming Zhou Yuanchun Fei
Department of Electronic Engineering Beijing Institute of Technology Beijing, 100081, P.R.China
国际会议
北京
英文
329-332
2009-10-27（万方平台首次上网日期，不代表论文的发表时间）