High Temperature Deformation Behavior and Microstructure Preparation of Cu-Ni-Si-P Alloy

摘要：

Dynamic recrystallization and dynamic recovery in Cu-Ni-Si-P alloy during high temperature deformation have been investigated by means of compression tests in the temperature and strain rate ranges of 873 to 1073 K and 0.01 to 5s-1 under maxium strain of 60％. The results show that the stress level decreases with increasing deformation temperature and decreasing strain rate, which can be represented by a Zener-Hollomon parameter in an exponent-type equation with the hot deformation activation energy Q of 485.6 kJ/mol. The hot deformation equation is:ε=4.62×1023sinh(0.016σ)7.06exp(-485.6×103/RT).

关键词： Cu-Ni-Si-P alloy hot deformation dynamic recrystallization Zener-Hollomon parameter microstructural evolution

作者: ZHANG Yi CHEN Xiao-hong LIU Ping TIAN Bao-hong LIU Yong JIA Shu-guo

作者单位: Department of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 4 Department of Mechanical Engineering, University of Shanghai for Science and Technology,Shanghai 200

会议类型: 国际会议

会议名称: The Fourth Asian Conference on Heat Treatment and Surface Engineering(第四届亚洲热处理及表面工程大会)

会议地点: 北京

会议语种:英文

页码: 241-244

在线出版日期: 2009-10-27（万方平台首次上网日期，不代表论文的发表时间）