Effect of Sputtering Pressure on Growth and Composition of Al-Cu-Fe Films

摘要：

The Al-Cu-Fe thin film was fabricated on silicon substrate by magnetron cosputtering method. The surface morphology, surface roughness and grain size were investigated by means of AFM. The effect of different sputtering pressure on the mechanism of film growth and variation of film composition was discussed. The results show that with the decrease of sputtering pressure, surface roughness and grain size decrease. While the sputtering pressure is 1.0Pa, the film growth exponent of film is 0.31 ± 0.10. The surface roughness exponent of film is decreased by the descending of sputtering pressure. The influence of sputtering pressure on the variation of film composition is complicated.

关键词： Al-Cu-Fe thin film magnetron sputtering sputtering pressure

作者: ZHOU Xi-ying HE Jia LIU Yan-hui XU Zhou

作者单位: Shanghai University of Engineering Science,Shanghai 201620,China Shanghai Jiao Tong University,Shang Shanghai University of Engineering Science,Shanghai 201620,China Shanghai Jiao Tong University,Shanghai 200030,China

会议类型: 国际会议

会议名称: The Fourth Asian Conference on Heat Treatment and Surface Engineering(第四届亚洲热处理及表面工程大会)

会议地点: 北京

会议语种:英文

页码: 502-505

在线出版日期: 2009-10-27（万方平台首次上网日期，不代表论文的发表时间）