Effect of Grain Size on Forming Process of Micro-socket Connecter
With the development of micro electronic and IC industries, the demand of micro foil component increases, which improves the development of micro manufacture technology. For the micro-socket connecter which is widely used in micro electronic industries, the investigation on micro blanking and bending was carried out. To raise the quality and analyze the forming process easily, the forming scheme of micro-socket connecter combined with three procedures was designed, and three sets of die devices were developed. With the micro servo punching system developed by our group, the forming experiments were performed, and the effects of grain size on the maximum punch load, section quality and springback were analyzed. The results show that the decreasing of maximum punch load, section quality and springback are observed with the increasing of grain size. The theoretic analysis is carried out considering the plastic deformation mechanism and free surface effect.
Grain Size Effect Section Quality Springback Free Surface Effect
C.J.Wang B.Guo D.B.Shan Y.Z.Wang J.Zhou F.Gong
School of Materials Science and Engineering, Harbin Institute of Technology, Harbin, 150001
国际会议
2nd Asian Workshop on Macro/Nano Forming Technology(AWMFT-2009)(第2届亚洲微米纳米技术研讨会)
长沙
英文
621-623
2009-10-25（万方平台首次上网日期，不代表论文的发表时间）