Corrosion Mechanism and Electrical Contact Behavior of Gold Plating on Contacts in SO2 Environment
It is found that the porosities of the same gold plating specimens and the distribution of corrosion products in gold coatings are different after corrosion test with different standards. In this article, the test method is carried to show the porosity of specimens in gold coatings and the testing procedure is based on ASTM and JIS standards. To study the corrosion mechanism and electrical contact behavior, series of inspections and analytical research methods are introduced. The surface morphology of specimens in gold coatings after corrosion is observed by stereoscopic microscope and scanning electron microscope (SEM). Chemical constitution was examined by X-ray energy spectrum. The contact resistances were measured by four-point method.The experiment results show that after corrosion test by SO2 with JIS corrosion test, the appearance of corrosion is severer than the ASTM corrosion test. The corrosion products appear islands-like spots on gold plating surface after corrosion test. The corrosion degree of gold plating specimens is decreased with the increase of the thickness of gold coatings. The porosity of Au0.3-Ni2.0-Cu specimen is higher than AuO.9-Nil.2-Cu specimens obviously, which indicate that the corrosion resistance of Au0.3-Ni2.0-Cu specimens is worst. The static contact resistances of islands-like spots appear higher contact resistance than normal value, which can reach to 2000 mΩ nearly. It is found the high and unstable contact resistance of the pore and products is more likely to cause contact failure. Through the analysis of the corrosion mechanism, the influencing factor of accounting the porosities after corrosion test with different standards can be sure, which have important influence on the porosity test and the analysis of contact failure of electric connector.
Contact failure Corrosion Porosity ASTM JIS
Kong Zhigang Mu Yu
Research Laboratory of Electrical Contacts 71＃ Beijing University of Post and Telecommunications, Beijing, 100876, China
国际会议
温州
英文
196-200
2009-10-18（万方平台首次上网日期，不代表论文的发表时间）