Thermal Field Simulation Analysis of Miniature DC Electromagnetic Relays

摘要：

The thermal performance of certain miniature DC electromagnetic relay is analyzed in this paper. Applying computer analysis can conveniently view the changes of the behavior of relays. The heat generated by coil and contact circuit has been analyzed in this paper using software ANSYS. In the analysis, the contact resistance is replaced by a little cylinder and the thermal effects of connected wires are considered and simplified. The temperature rise of coil with different coil voltage is analyzed, as the model is with shell and without shell. The temperature distribution of relay is obtained as it working in normal operation, and the analysis results are compared with test data.

关键词： DC relays Thermal field Analysis

作者: Su Xiuping Lu Jianguo Liu Guojin Chang Wei

作者单位: Institute of Electrical Apparatus, Hebei University of Technology,Tianjin 300130, China

会议类型: 国际会议

会议名称: 第三届电工产品可靠性与电接触国际会议(The 3rd International Conference on Reliability of Electrical Products and Electrical Contacts)

会议地点: 温州

会议语种:英文

页码: 233-238

在线出版日期: 2009-10-18（万方平台首次上网日期，不代表论文的发表时间）