Tin Solderability Failure Analysis of the Tinned Brass Terminal

摘要：

The tin solderability of the tinned brass degenerates gradually after the electric plating. In this paper, the degenerative reason is investigated by metallographic microscopy (MM), scanning electron microscopy (SEM) and X-ray energy spectrum (EDS). The results show that a zinc-contained layer can be observed on the brass surface. The layer is resulted from the zinc atoms in the brass diffusing to the surface. Because of the low solid solubility of the Zn-Sn alloy and the low electric negative, the zinc is easy to be oxygenated and the soldering tin is hard to adhere to the brass terminal. A solution basing on the results is introduced at the end of this paper.

关键词： Tinned Brass Tinsolderability Failure analysis

作者: Jiang Changliu Guo Qiaoling Lu Ningyi

作者单位: Xiamen Hongfa Electroacoustic Co.,Ltd, Xiamen, 361021, China

会议类型: 国际会议

会议名称: 第三届电工产品可靠性与电接触国际会议(The 3rd International Conference on Reliability of Electrical Products and Electrical Contacts)

会议地点: 温州

会议语种:英文

页码: 355-357

在线出版日期: 2009-10-18（万方平台首次上网日期，不代表论文的发表时间）