Failure Analysis for the Clapper Type Relay under Shock Conditions

摘要：

According to the failure mechanism of the clapper type relay caused by external shock excitation, a 3D finite element model of the clapper relay was built, and the transient responses subjected to shock excitation was simulated by Msc.Patran/Nastran. Shock responses, such as contact force response and loss contact are respectively analyzed under shock excitation with different magnitudes, which were testified by shock test over practical products. Furthermore, the relationship between size parameters and shock responses is investigated, and some valuable suggestions for the shock resistance optimization of the clapper relay are presented.

关键词： the clapper type relay shock finite element method

作者: Chen Yinghua Zhai Guofu Ren Wanbin Kang Yunzhi Cui Li

作者单位: School of Electrical Engineering and Automation Harbin Institute of Technology, Heilongjiang Provinc Guilin Aerospace Electronic Technologies Company Limited, Guilin, 541002, China

会议类型: 国际会议

会议名称: 第三届电工产品可靠性与电接触国际会议(The 3rd International Conference on Reliability of Electrical Products and Electrical Contacts)

会议地点: 温州

会议语种:英文

页码: 363-366

在线出版日期: 2009-10-18（万方平台首次上网日期，不代表论文的发表时间）