Fracture Failure Analysis of the Reeds in the Relay

摘要：

Fracture is a most common failure of the reeds in the relay. In this paper, the fracture mechanism of the reeds is analyzed by microscope, metallographic examination, scanning electrical microscopy (SEM), X-ray diffraction spectrum (XRD) and inductively coupled plasma technology (ICP). The results show that the fracture is affected by composition, microstructure, surface state, processing technology and so on. An analysis procedure is also concluded in this paper.

关键词： Low-voltage electrical appliance Reed Fracture Failure analysis Mechanism

作者: Xu Weimu Zhang Jiliang Xue Shoulu Li Jian

作者单位: Xiamen Hongfa Electroacoustic Co.,Ltd, Xiamen, 361021, China Xiamen Hongfa Electroacoustic Co.,Ltd, Xiamen, 361021, China Zhejiang University, Hangzhou, 310027, Zhejiang University, Hangzhou, 310027, China

会议类型: 国际会议

会议名称: 第三届电工产品可靠性与电接触国际会议(The 3rd International Conference on Reliability of Electrical Products and Electrical Contacts)

会议地点: 温州

会议语种:英文

页码: 394-396

在线出版日期: 2009-10-18（万方平台首次上网日期，不代表论文的发表时间）