Study on the Reliability of Laser Scribe Break in the Manufacturing Process of LED Chip

摘要：

Laser scribe break is an important process in semiconductor manufacturing. Its result directly impacts on the quality of LED chips, particularly the reliability of the components. Based on the problems such as cutting depth and cutting trace in the actual production process of Laser cutting process, we have found cause which influences the chip quality. The improvement measures are put forward in order to ensure the quality of laser cutting and improve the reliability of LED chips.

关键词： LED chip laser scribe break reliability failure reason

作者: Yuan Fei

作者单位: Tonghui Electronics Corporation Co.,Ltd, Luquan, 050200, China

会议类型: 国际会议

会议名称: 第三届电工产品可靠性与电接触国际会议(The 3rd International Conference on Reliability of Electrical Products and Electrical Contacts)

会议地点: 温州

会议语种:英文

页码: 425-428

在线出版日期: 2009-10-18（万方平台首次上网日期，不代表论文的发表时间）