Mode III crack problem of two bonded FGPM strips with embedded arbitrarily oriented cracks
This paper studies the mode III crack problem of two bonded functionally graded piezoelectric material (FGPM) strips.Each strip contains an arbitrary oriented crack.The material properties of the strips are assumed in exponential forms in the direction normal to the interface.The crack surface condition is assumed to be electrically impermeable or permeable.Using the Fourier transform technique,the problem can be reduced to a system of singular integral equations,which are then solved numerically by applying the Gauss-Chebyshev integration formula to obtain the stress intensity factors at the crack tips.Numerical calculations are carried out to obtain the energy density factor S.The effects of the non-homogeneous parameters,crack orientations,crack interactions,and the magnitude of the electric loading on the energy density factors are discussed graphically.The results can be used to predict the fracture behavior of two bonded strips once the cracks exist inside the structure.
Arbitrarily oriented crack FGPM Gauss-chebyshev integration formula Energy density factor
Chinghwei Chue Chiennan Yeh
Department of Mechanical Engineering,National Cheng Kung University,No.1,Dasyue Road,70101 Tainan,China
国际会议
成都
英文
183-188
2009-10-16(万方平台首次上网日期,不代表论文的发表时间)