Creep constitutive relations and creep mechanism of Ag particle enhancement Sn-0.7Cu based composite solder joints
In the paper,a novel equipment of high temperature creep strain test was used for testing materials used in the micro-electronic technology and solder joints.Based on the Dorn Equation,measurements were conducted on Ag particle enhancement Sn-0.7Cu based composite solder joints for confirming the creep parameters,i.e.,stress exponent,activation energy and constant A.The final constitutive equation for the solder joints was established.The creep mechanism of the Ag particle enhancement Sn-0.7Cu based composite solder joints is studied.Results show that the exponents of the composite solder joints can be divided into two regions by stress:low stress region and high stress region and the stress exponents at low stress region are all more than those at high stress region at the same temperature.The stress exponents of two regions demonstrate an increasing trend as the temperature decreases under the same stress,which indicates that creep resistance is more obvious at lower temperature.The average creep activation energy at low stresses is larger than that at high stresses and the absolute values of the activation energies take an increasing trend with stress decreasing at the same temperature,which indicates that creep resistance is more obvious at lower stresses.At the same time,the dislocation climbing of the Ag particle enhancement Sn 0.7Cu based composite soldered joint was dominated by the lattice self-diffusion process under high temperature and low stress and dominated by the dislocation pipe diffusion process under low temperature and high stress.
Creep constitutive relations Creep mechanism,Particle enhancement Sn-0.7Cu based coposite solder Solder joints
Yanfu Yan Guoxin Wang Kun Tang Kexing Song Miaohui Wang
Henan Key Laboratory of Advanced Non-ferrous Metals,Luoyang 471003,China Advanced Manufacture Technology Center,China Academy of Machinery Science & Technology,Beijing 10008
国际会议
成都
英文
225-232
2009-10-16（万方平台首次上网日期，不代表论文的发表时间）