Measurement on Three-dimension Profile of MEMS Device Structures based on Infrared Light Reflection Interference
A new method of measuring three-dimension profile of MEMS device structures based on infrared light reflection interference is developed in this paper. The measurement system comprised infrared light source, interference microscope, infrared light CCD, ceramic piezo and software of data analyzing. The three-dimension profile of MEMS device structures was obtained by vertical scanning interferometry and consistent with SEM image. Its lateral resolution is 0.18um, vertical resolution is 0.1um. The application of reflection interference technology in three-dimension profile reconstruction was extended from white light to infrared light.
CHOU Xiujian NIU Kangkang LIU Yi XUE Chenyang ZHANG Wendong
Key Laboratory of Instrumentation Science & Dynamic Measurement (North University of China), Ministry of EducationDepartment of Electronic Science and technology, North university of China, Taiyuan, Shanxi, China, 030051
国际会议
第八届国际测试技术研讨会(8th International Symposium on Test and Measurement)
重庆
英文
1789-1792
2009-08-01（万方平台首次上网日期，不代表论文的发表时间）