Package and test of multi-ranged micro accelerometer

摘要：

Expensive package cost has become the choke point for the development of MEMS. It is necessary to pay much attention on the development of the low-cost and high-performance package technology for MEMS. In the present work, the optimum package method was obtained via the investigation on the characteristics of the multi-ranged micro accelerometer and the analysis of the influence of the packaging stress on the output of the accelerometer. The performances of the packaged accelerometer were tested, and the results showed that the accelerometer can works normally within four measurement ranges.

关键词： Package Multi-Ranged Micro Accelerometer Package stress Test

作者: Tao GUO Changwei JUAN

作者单位: National Key Laboratory For Electronic Measurement Technology Taiyuan Shanxi 030051, China

会议类型: 国际会议

会议名称: 第八届国际测试技术研讨会(8th International Symposium on Test and Measurement)

会议地点: 重庆

会议语种:英文

页码: 2133-2136

在线出版日期: 2009-08-01（万方平台首次上网日期，不代表论文的发表时间）