Design of sensing head of pyroelectric infrared detector

摘要：

Using <100> orientation of Lithium Niobate chip, we design two cylindrical tool, then chip would be thinned; using the graphite and steel cylindrical, two sets of bonding tool are designed. Program one, pressure is from 20 mm high block; Program two, pressure is provided by the thermal expansion. We will electrode plated on the chip and carry out corrosion on silicon substrates. We discuss the design of the primary amplifier circuit of the chip,packaging good chip and circuit.

关键词： wafer thinning graphite Bonding circuit

作者: DU Wen-long LIANG Ting XUE Cheng-yang TANG Jian-jun SUN Rui-xia REN Xiao-li

作者单位: Key Laboratory of Instrumentation Science & Dynamic Measurement .Ministry of Education, Taiyuan 0300 National Key Laboratory For Electronic Measurement Technology Taiyuan 030051,China Xiao-li1,2 Key Laboratory of Instrumentation Science & Dynamic Measurement .Ministry of Education, T

会议类型: 国际会议

会议名称: 第八届国际测试技术研讨会(8th International Symposium on Test and Measurement)

会议地点: 重庆

会议语种:英文

页码: 2298-2301

在线出版日期: 2009-08-01（万方平台首次上网日期，不代表论文的发表时间）