3D Floorplan Design

摘要：

This talk focuses on the floorplan design problem for 3D ICs. The traditional 2D floorplan design problem has been extensively studied in the past 30 years. We first give a brief overview of the history of 2D floorplan design. We then point out some lessons that we can learn from these prior research efforts which potentially will benefit research in 3D floorplan design.

作者: Martin D.F.Wong

作者单位: Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign

会议类型: 国际会议

会议名称: 2009国际通信电路与系统学术会议(ICCCAS 2009)(2009 International Conference on Communications，Circuits and Systems)

会议地点: 成都

会议语种:英文

页码: 1097-1097

在线出版日期: 2009-07-23（万方平台首次上网日期，不代表论文的发表时间）