A 3D Physical Design Flow Based on Open Access

摘要：

3D IC technologies have recently attracted great attention due to the potential performance improvement, power consumption reduction and heterogeneous integration. In this paper we present a 3D physical design flow based on OpenAccess (named 3D-Craft) to facilitate the rapid adoption of 3D technology. The OpenAccess extension for 3D-Craft is discussed, and the key components including the 3D placer mPL-3D and the 3D router TMARS are presented. We also demonstrate the application of 3D-Craft for the 3D physical design of an open-source processor, and show that the 3D implementation can reduce both the half-perimeter wirelength and the routed wirelength by about 30％ compared to the 2D implementation.

作者: Jason Cong Guojie Luo

作者单位: Computer Science Department University of California, Los Angels California NanoSystems Institute Los Angeles, CA 90095, USA

会议类型: 国际会议

会议名称: 2009国际通信电路与系统学术会议(ICCCAS 2009)(2009 International Conference on Communications，Circuits and Systems)

会议地点: 成都

会议语种:英文

页码: 1103-1107

在线出版日期: 2009-07-23（万方平台首次上网日期，不代表论文的发表时间）