Dynamic Power and Thermal Integrity in 3D Integration
This paper presents a state-of-art advance in 3D integrations. It illustrates the need for a high-performance 3D design driven by dynamic power and thermal integrity. The through-silicon-via (TSV) is used to simultaneously deliver power supply and remove heat. More importantly, to cope with the large-scale design complexity, the modern macromodeling technique is applied to handle not only large numbers of dynamic inputs/working-loads but also large sizes of RLC/RC networks distributing the power/heat. Experiments applying the 3D design presented by this paper showed promising results to reduce both runtime and resource.
Hao Yu Lei He
Berkeley Design Automation, Santa Clara, CA 95054, USA Department of Electrical Engineering, UCLA, Los Angeles, CA 90095, USA
国际会议
2009国际通信电路与系统学术会议(ICCCAS 2009)(2009 International Conference on Communications，Circuits and Systems)
成都
英文
1108-1112
2009-07-23（万方平台首次上网日期，不代表论文的发表时间）