3D Technology Based Circuit and Architecture Design

摘要：

Package stacking, die stacking, wafer stacking, and device stacking are the four different types of three dimensional (3D) technology. Except for package stacking, the other three stacking techniques require special considerations when designing circuits and systems. In this paper, different stacking techniques will first be reviewed, followed by an introduction to the possible applications for 3D circuits and systems, including sensor systems, processor-memory systems, Network-on-Chip designs, and Field-Programmable Gate Arrays. The paper will also provide key design considerations in 3D circuits and systems, and use a sensor system as an example to summarize 3D design issues discussed.

作者: Yi-Chang Lu

作者单位: Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan China

会议类型: 国际会议

会议名称: 2009国际通信电路与系统学术会议(ICCCAS 2009)(2009 International Conference on Communications，Circuits and Systems)

会议地点: 成都

会议语种:英文

页码: 1124-1128

在线出版日期: 2009-07-23（万方平台首次上网日期，不代表论文的发表时间）