New IGBT Power Module for DFIG Application
The requirements for DFIG Windmill application are getting more and more ambitious. The reliability expectation for high power IGBT modules is getting higher and higher and this is a new challenge for the IGBT module supplier. Temperature cycle, load cycle and temperature swing are dominating in the selection of the power IGBT modules. SEMIKRON will introduce a 1700V-IGBT module which has no solder connection in the module. The DCB is pressured to the heat sink without base plate (no solder layer necessary) and the IGBT chip is sintered to the DCB (no solder layer). All terminals are contacted with spring contact technology or special high current pressure technology. The internal module construction provides a very low stray inductance and the terminals are optimized for a low stray inductance DC bus design. Optimized paralleling of IGBT chip guarantees are very good current sharing inside the IGBT module and temperature distribution to the heat sink. Load cycle and temperature cycle capability could be improved and guarantee long life time of the IGBT power module. The new IGBT power module is available in 1200V and 1700V in Trench 4 Technology and current up to 1250A by 80 degree.
Norbert Pluschke
SEMIKRON (Hong Kong) Co., Ltd., Hong Kong
国际会议
The Eighth International PCIM China(第八届电子功率器件、智能传送、电源质量国际研讨会)
上海
英文
71-76
2009-06-02（万方平台首次上网日期，不代表论文的发表时间）