Spring Pressure Contacts for Flezible Reliable Interconnections in Power Modules

摘要：

The connection between a power module and the load and control contacts on the printed circuit board is an important feature for both reliability and ease of assembly. An especially advantageous solution is the use of multiple spring contacts, because it requires no solder or screw process during assembly and the positioning of the springs on the DBC can be freely chosen. The spring material has to be carefully selected, as ideal mechanical and electrical properties cannot be achieved with the same material.

作者: F.Lang U.Scheuermann

作者单位: SEMIKRON Elektronik GmbH & Co.KG, Sigmundstrasse 200, 90431 Nuremberg, Germany

会议类型: 国际会议

会议名称: The Eighth International PCIM China(第八届电子功率器件、智能传送、电源质量国际研讨会)

会议地点: 上海

会议语种:英文

页码: 96-100

在线出版日期: 2009-06-02（万方平台首次上网日期，不代表论文的发表时间）