State of the Art in High Power IGBT Module technology for Automotive Applications
The electric vehicle markets today require power modules with high power density, high reliability, and mechanical, thermal and electrical ruggedness. This is best met by solder-free pressure contact technology. This helps to overcome today’s limitations on power cycling fatigue. Superior performance in power density could be achieved by deploying new technologies not only to power modules, but to un-package these modules and design embedded systems by mechanical integration. The automotive market share for power modules is only 4 ％, but is growing strongly with about 20％ per year.
Thomas Grasshoff
SEMIKRON International GmbH Sigmundstrasse 200 90431 Nuernberg, Germany
国际会议
The Eighth International PCIM China(第八届电子功率器件、智能传送、电源质量国际研讨会)
上海
英文
259-262
2009-06-02（万方平台首次上网日期，不代表论文的发表时间）