Material Removal Model of Sapphire Substrate in Double-side Lapping Process

摘要：

The material removal mechanisms of sapphire substrate in double-side lapping process were studied. The concepts of brittle vs. ductile machining and two-body vs. three-body abrasion were used to classify the processing mechanisms. The material removal models of double-side lapping process in different mechanisms were analyzed and researched. The experiment showed that the material removal model can describe double-side lapping process of sapphire qualitatively.

关键词： Sapphire Double-side lapping Processing mechanism Material removal model

作者: LU Congda QIAN Dongmin JIANG Shaofei

作者单位: The MOE Key Laboratory of Mechanical Manufacture and Automation, Zhejiang University of Technology, The MOE Key Laboratory of Mechanical Manufacture and Automation, Zhejiang University ofTechnology, H

会议类型: 国际会议

会议名称: 第九届加工技术进展国际会议(9th International Conference on Progress of Machining Technology)

会议地点: 昆明

会议语种:英文

页码: 460-464

在线出版日期: 2009-04-25（万方平台首次上网日期，不代表论文的发表时间）