The Analysis on The Stability of Diamond Wire Saw Cutting Process tor The Silicon

摘要：

In this paper, the model of fixed abrasive diamond wire saw has been set up, and its cutting mechanism has been discussed. Then, the material removal rate model and wire saw cutting efficiency model have been established. the speed of wire saw, the number of the dynamic effective abrasive and the workpiece feed rate have been analyzed to study their impaction on the stability of cutting process. Finally, some rules and suggestions were brought forward.

关键词： Silicon wafers Diamond wire saw Material removal rate

作者: Zhao Ligang Zuo Dunwen Sun Yuli Wang Min

作者单位: College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics andAstronautics,

会议类型: 国际会议

会议名称: 第九届加工技术进展国际会议(9th International Conference on Progress of Machining Technology)

会议地点: 昆明

会议语种:英文

页码: 684-689

在线出版日期: 2009-04-25（万方平台首次上网日期，不代表论文的发表时间）