DISTRIBUTION AND CORROSION BEHAVIORS OF THE TRIPLE JUNCTIONS IN A GRAIN BOUNDARY ENGINEERED 304 STAINLESS STEEL
Grain boundary character distribution (GBCD) and triple junction character distribution (TJCD) in a 304 stainless steel cold rolled with the thickness reduction of 6％ and then annealed at 1323K for 5 minutes(GBE process) were analyzed by electron back scatter diffraction (EBSD). The intergranular corrosion (IGC) resistance of various triple junctions and grain boundaries were evaluated after sensitization treatment at 1073K for 30 minutes. The results showed special TJ containing 2 or 3 CSL boundaries exhibit higher resistance to IGC than other TJs. In addition, the 411 and 221 symmetrical tilt grain boundaries (STGBs) are more resistant to intergranular corrosion for ?9 boundaries.
Grain boundary character distribution triple junction character distribution CSL boundaries 304 stainless steel
XIAOYING FANG WEIGUO WANG HONG GUO CONGXIANG QIN BANGXIN ZHOU
School of Mechanical Engineering, Shandong University of Technology, Zibo, China Institute of Materials, Shanghai University, Shanghai, China
国际会议
第五届先进材料与加工国际会议(Fifth International Conference on Advanced Materials and Processing ICAMP-5)
哈尔滨
英文
1110-1115
2008-09-03（万方平台首次上网日期，不代表论文的发表时间）