CONTROLLING AND OPTIMIZATION OF THERMAL PROFILE IN REFLOW SOLDERING
Heating factor, Q is a quantitative parameter describing a process of reflow soldering. It can be used to evaluate a reflow soldering process and the reliability of solder joints. The value of Q is directly related to the energy absorbed by solder joint during heating and the morphology of Intermetallic Compound formed at the interface between solder and pad. Electronic product manufacturers use heating factor as a technical evaluation parameter to guide the adjustment of reflow soldering process and the optimization of reflow soldering curve, to ensure the best reliability of the circuit board. Solder paste manufacturers use heating factor to represent characteristics of their reflow soldering products, and to customize products according to consumers requests. Equipment manufacturers for reflow soldering use heating factor as an important controlling parameter to establish automatic system for managing solder joint reliability. A reliable soldering result can be achieved using the automatic reflow management system, to control and optimize thermal profile, which leads to the adjustment of the heating factor.
Heating factor reliability of solder joint thermal profile intermetallic compound
JIANWEI SHI PENG HE XIAOCHUN LV
National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, Peoples Republic of China
国际会议
第五届先进材料与加工国际会议(Fifth International Conference on Advanced Materials and Processing ICAMP-5)
哈尔滨
英文
1949-1955
2008-09-03（万方平台首次上网日期，不代表论文的发表时间）