New Assembly Technology for Soldered Thyristor Modules

摘要：

The market trend for high reliability is also driving the development in the area of soldered bipolar modules. The redesigned module’s construction with less solder layers, corner gate thyristors and upgraded technology for spring pressure contact, improves reliability and reduces thermal resistance. The result is 10％ enhanced output current.

作者: Melanie Gill Jie Ma

作者单位: SEMIKRON Elektronik GmbH & Co.KG Sigmundstrasse 200 90431 N(u)rnberg, Germany

会议类型: 国际会议

会议名称: The Seventh International PCIM China(第七届电子功率器件、智能传送、电源质量国际研讨会)

会议地点: 上海

会议语种:英文

页码: 12-15

在线出版日期: 2008-03-18（万方平台首次上网日期，不代表论文的发表时间）