New 50A and 75A/600V Transfer Mold IPMs with heat dissipating insulation sheet

摘要：

This paper presents a large-scale Dual In-line Package Intelligent Power Module (DIPIPM TM Ver.4 series) with ratings of 50A and 75A/600V developed by Mitsubishi Electric for home appliances and package air conditioner. 75A/600V large-scale DIPIPM TM Ver.4 has been achieved by development of 5th generation full gate CSTBT TM, shrink process ICs and novel heat dissipating insulation sheet, etc.

作者: Ming Shang Kazuhiro Kuriaki Toru Iwagami Hisashi Kawafuji Toshiya Nakano

作者单位: Power Device Works, Mitsubishi Electric Corporation, Japan 1-1-1, Imajukuhigashi, Nishi-ku, Fukuoka-City, Fukuoka, 819-0192, Japan

会议类型: 国际会议

会议名称: The Seventh International PCIM China(第七届电子功率器件、智能传送、电源质量国际研讨会)

会议地点: 上海

会议语种:英文

页码: 16-20

在线出版日期: 2008-03-18（万方平台首次上网日期，不代表论文的发表时间）