Two Dimensional Thermal Modelling with Spreading Heat Flow and its Analytical Solution for Heat Sink Application in Electronics Packaging
By decomposition of a thermal model for heat sink application, two separate two-dimensional thermal models are developed. Neglecting the thermal resistance along the thickness direction of heat sink base plate, there exists a simplified two-dimensional heat transfer problem. The defining differential equations for heat transfer are modified homogeneous and inhomogeneous Bessel equations in a onedimensional cylindrical coordinate system. The analytical solution for temperature distribution is obtained using boundary and coupling conditions of two separated models for predicting thermal constriction/spreading resistance. The magnitude of application of the proposed analytical solution is analyzed and discussed. The error range of the method is indicated.
Two dimensional thermal model thermal spreading resistance modified Bessel function
Fan Wang Peter Zacharias
Department for Power Supply Systems, University of Kassel 34121 Kassel, Germany
国际会议
The Seventh International PCIM China(第七届电子功率器件、智能传送、电源质量国际研讨会)
上海
英文
88-93
2008-03-18（万方平台首次上网日期，不代表论文的发表时间）