Environmentally Benign Material Removal Processes for the Fabrication of Microdevices

摘要：

INTRODUCTIONNon-contact material removal processes offer numerous advantages over traditional machining approaches and nowhere is this more apparent than in the fabrication of micro devices. Current micromachining techniques such as microgrinding and micromilling have limitations with respect to their positioning accuracy and tool deflections. Electro thermal processes such as microEDM and laser machining usually result in a heat affected zone being produced. Other approaches such as etching and non-contact ultraprecision polishing are either costly or are not suitable for high throughput. In order to address these limitations, alternative micromachining techniques are required.

作者: Steven Danyluk Travis Blackburn David Butler Leo Cheng Seng

作者单位: George W.Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta.GA Nanyang Technological Universuty Singapore

会议类型: 国际会议

会议名称: 10th International Symposium on Eco-Materials Processing and Design(第10届国际生态材料加工与设计研讨会)

会议地点: 西安

会议语种:英文

页码: 451-456

在线出版日期: 2009-01-13（万方平台首次上网日期，不代表论文的发表时间）