会议专题

Thermal Conductivity for Measuring Insulation Materials at Low Temperatures

Associating with the properties of polyurethane foam in low temperature, a flat-plate thermal conductivity apparatus has been developed to measure the thermal conductivity of foam from 100 K down to 6 K. The differential thermal conductivity and the mean thermal conductivity at low temperature can be gained by controlling the temperatures of the plates.

Metrology Thermal conductivity Insulation material Low temperature

YU Li-hong YANG Ru-ping ZHANG Qing-geng HANG Zan

The Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Beijing 100190, Chin Aerospace Research Institute of Materials & Processing Technology, Beijing, China

国际会议

2008年国际温度与热物性测量会议(TEMP BEIJING 2008)

北京

英文

250-252

2008-10-20(万方平台首次上网日期,不代表论文的发表时间)