会议专题

IC Innovations in Automotive

The fierce competition in the car industry drives the evolution of cars in terms of performance and price more than ever.Continuous improvement of car comfort and performance,at competitive price levels,poses a wealth of innovation challenges to the manufacturers of the ICs that are omnipresent in todays cars.Moreover,the growing awareness on sustainability drives semiconductor developments like power solutions and sensors for engine management,solid-state lighting,tire pressure monitoring and drive/steer-by-wire via In-Vehicle Networking,aimed at weight reduction. The semiconductor content in cars grows by over 4% each year,mainly in advanced infotainment,intelligent safety,comfort features,but also to support trends in energy saving. The semiconductors onboard an average car in 2010 will represent $450 value (US/EU/Japan). These trends make semiconductors one of the fastest growing segments in the semiconductor industry.A significant difference with ICs for consumer electronics are the reliability specifications in automotive: whereas defect rates in the range of 10 ppm (parts-per-million) are excellent for most consumer applications,they are unacceptably high for automotive applications. The ever stricter specs on safety,reliability and environmental impact constantly raise the bar for chip manufacturers.Consequently the development of ICs for automotive applications means dealing with increased design complexity,increased software content,zero-failure reliability specs and adaptation of new technologies,all at competitive cost levels. New Design-for-Excellence approaches and new validation methodologies are required to optimize quality,cost and Time-to-MarketIn this paper we will discuss the technologies required for In-Vehicle Networking,Magnetoresistive Sensors and Infotainment.

Rene Penning de Vries

SVP & CTO,NXP Semiconductors High Tech Campus 60,5656 AG Eindhoven,The Netherlands

国际会议

9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)

北京

英文

5-6

2008-10-20(万方平台首次上网日期,不代表论文的发表时间)