Application Oriented MEMS by Open Collaboration

摘要：

Silicon MEMS as electrostatically levitated rotational gyroscope and 2D optical scanner,and wafer level packaged devices as integrated capacitive pressure sensor and MEMS swatch are described MEMS which use non-silicon materials as diamond,CNT (carbon nano tube),LTCC with electrical feedthrough,SiC (silicon carbide) and LiNbO3 for multi-probe data storage,multi-column electron beam lithography system,probe card for wafer-level burn-in test,mold for glass press molding and SAW wireless passive sensor respectively are also described.

作者: Masayoshi Esashi

作者单位: The World Premier International Research Center Advanced Institute for Materials Research,Tohoku University Sendai,980-8579,Japan

会议类型: 国际会议

会议名称: 9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)

会议地点: 北京

会议语种:英文

页码: 7-12

在线出版日期: 2008-10-20（万方平台首次上网日期，不代表论文的发表时间）