Estimation of process variation impact on DG-FinFET Device performance using Plackett-Burman Design of Ezperiment Method
This paper studies various Double-Gate (DG) FinFET structures optimized for better off state and on state performance. In this work,we study the impact of process variation on the performance of DG-FinFET device with 20nm gate length. This was achieved through calibrated TCAD simulations.We show that the spacer thickness variation has the highest impact on Ion,of the DG-FinFETs. In this work,we also have demonstrated the suitability of method of Plackett-Burman Design of Experiments (PB-DOE),for accurate estimation of the impact of the large number of process parameter-variations on DG-FinFET devices electrical performance.
A.N.Chandorkar Sudhakar Mande Hiroshi Iwai
Department of Electrical Engineering,Indian Institute of Technology Bombay,Powai,Mumbai -400076,Indi Frontier Collaborative Research Center,Tokoyo Institute of Technology,4259,Nagatsuta,Midori-Ku,Japan
国际会议
9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)
北京
英文
215-218
2008-10-20(万方平台首次上网日期,不代表论文的发表时间)