Fabrication of improved FD SOIMOSFETs for suppressing edge effect
FD SOI MOSFETs with MESA and Irradiated FD SOI MOSFETs with LOCOS isolation usually show the edge effect,that is,the leakage current called hump is generated in the subthreshold region.According to different reasons for generating the edge effect,rounded corner process and BTS structure are applied to improve device performance. The results indicate that the above two methods are effective to reduce the edge effect and qualified devices are fabricated successfully.
Ningjuan wang Ning Li Zhongli Liu Fang Yu Guohua Li
Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,P.R.China State Key Laboratories of Transducer Technology
国际会议
9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)
北京
英文
231-234
2008-10-20(万方平台首次上网日期,不代表论文的发表时间)