Analysis of Metal Routing Technique in a Novel Dual Direction Multi-finger SCR ESD Protection Device

摘要：

A novel dual direction SCR (DDSCR) ESD protection device is implemented in HJTK 0.18-μm CMOS process without deep N-well or T-well masks.Both parallel and anti-parallel metal routing method of multi-fingered DDSCR is investigated in this paper. It shows that metal routing in layout design plays an important role in the performance of multi-fingered DDSCR due to its symmetrical TLPI-V plot characteristics.

关键词： DDSCR ESD routing multi-fingered TLP

作者: Du Xiaoyang Dong Shurong Han Yan J J Liou

作者单位: ESD Lab,Dept of ISEE,Zhejiang University,Hangzhou 310027,China

会议类型: 国际会议

会议名称: 9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)

会议地点: 北京

会议语种:英文

页码: 337-340

在线出版日期: 2008-10-20（万方平台首次上网日期，不代表论文的发表时间）