会议专题

Thermal analysis of ICs based on equivalent thermal resistance

The paper presents a new method to analyze the steady-state temperature distribution of integrated circuit. According to the application of ANSYS,aiming at the complicated model and large calculation amount of very large scale integrated circuits,we present a new concept defined as equivalent thermal resistance. Based on the equivalent thermal resistance,the temperature distribution of an analog integrated circuit is calculated. And the result is verified by doing a complete ANSYS analysis.

Equivalent thermal resistance analog integrated circuit temperature distribution

Rong Su Shiwei Feng Chunsheng Guo Bin Zhang Hao Meng Guangchen Zhang

School of Electronic Information & Control Engineering,Beijing University of Technology,Beijing 100124,China

国际会议

9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)

北京

英文

456-459

2008-10-20(万方平台首次上网日期,不代表论文的发表时间)