Analysis of Carbon-based Interconnect Breakdown

摘要：

Current-induced breakdown phenomena of carbon nanofibers (CNFs) for future on-chip interconnect applications are presented The effect of heat dissipation via the underlying substrate is studied using different experimental configurations. Scanning electron microscopy (SEM) techniques are utilized to study the structural damage by current stress. While the measured maximum current density in the suspended CNF in air is inversely proportional to nanofiber length and independent of diameter,SiO2-supported CNFs improves their current capacity,which implies effective heat dissipation to the oxide. The correlation between maximum current density and electrical resistivity confirms the importance of local Joule heating,showing strong coupling between electrical and thermal transport in CNFs.

作者: Hirohiko Kitsuki Tsutomu Saito Toshishige Yamada Drazen Fabris Patrick Wilhite Makoto Suzuki Cary Y.Yang

作者单位: Center for Nanostructures,Santa Clara University Santa Clara,California 95053-0569,USA

会议类型: 国际会议

会议名称: 9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)

会议地点: 北京

会议语种:英文

页码: 530-533

在线出版日期: 2008-10-20（万方平台首次上网日期，不代表论文的发表时间）