Novel structural Ti/Al-based ohmic contacts on AlGaN/GaN heterostructures
To improve the performances of ohmic contacts for GaN devices,a novel multilayer Ti/Al-based metal scheme (Ti/Al/Ti/Al/Ti/Al/Ti/Al/Ni/Au0) on undoped AlGaN/GaN heterostructures was employed. A contact with pc (specific contact resistance) of 8.74E-07 Ω-cm2,Rc of 0.22 Ω-mm was demonstrated. Ohmic contacts with the novel metal structure were measured with I-V,SEM,HRTEM to show their properties. The results showed that ohmic contacts with novel structures have better surface morphology and proposed thermal stability than those using conventional Ti/Al/Ni/Au metal scheme,therefore ohmic contacts with novel structures should be better candidates for high power and high frequency GaN devices.
AlGaN/GaN ohmic contacts surface morphology
Zhihua Dong Jinyan Wang Min Yu Yilong Hao C.P.Wen Yangyuan Wang
Key Laboratory of Microelectronic Devices and Circuits,Institute of Microelectronics,Peking University,100871
国际会议
9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)
北京
英文
1110-1113
2008-10-20(万方平台首次上网日期,不代表论文的发表时间)