Single Wafer All-Wet Photo Resist Strip Process for LDD Implant in CMOS Technology

摘要：

This paper reports the comparison between conventional ash followed by wet bench process approach and the new all wet process for LDD implant application. The comparison covers the areas of defect performance,(material loss,electrical data,yield) and chemical consumption.

作者: Paolo Bonfanti Reinhard Sellmer Glen Liu Youfeng He Liu Hao Sally-Ann Henry Lutz Deutschmann Leo Archer

作者单位: SMIC,Wen Chang Road 18,100176 Beijing,P.R.C SEZ AG,SEZ-StraBe 1,9500 Villach,Austria

会议类型: 国际会议

会议名称: 9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)

会议地点: 北京

会议语种:英文

页码: 1177-1179

在线出版日期: 2008-10-20（万方平台首次上网日期，不代表论文的发表时间）