The Study on the Thermal behavior of Packaged Power LEDs

摘要：

The reliability of power LEDs has strong dependence on successful package thermal management. In this paper,heating response curves of LEDs were recorded by the temperature sensitive parameter (TSP) method and fast-switching circuit techniques. It provided a novel method to analyze thermal resistance composition of power LEDs packaging. Cover-and-block method was presented to provide a correction to the apparent thermal resistance of optical devices,and an electrical method to obtain radiant efficiency was also put forward.

关键词： packaged power LED thermal resistance radiant efficiency reliability

作者: Guangchen Zhang Shiwei Feng Lu Wang Xuesong Xie Lichao Gao Haijie Meng

作者单位: School of Electronic Information & Control Engineering,Beijing University of Technology,Beijing 1001 School of Electronic Information & Control ngineering,Beijing University of Technology,Beijing 10012

会议类型: 国际会议

会议名称: 9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)

会议地点: 北京

会议语种:英文

页码: 1211-1214

在线出版日期: 2008-10-20（万方平台首次上网日期，不代表论文的发表时间）