Challenges and Solutions of Post Etch Post Ash Residue Removal

摘要：

Wet cleaning technology plays a critical role in 1C industry,and takes up around 30% of whole process. With the critical dimension continuous shrinking,there are many additional requirements exposed. Among BEOL (back end of line) post etch post ash residue removal technology,galvanic corrosion elimination,low geometry via cleaning,pad crystal defect reduction and environment friendly are the major requirements. But the conventional cleaning technologies are challenging to meet them. In this paper,we will share our studies of key aspects in post etch post ash residue removal system,such as: surface energy reduction,substrate materials protection and being environmental conscientious. By those studies,the challenges are addressed,and improved performance for both organic and inorganic residues removal is achieved. Further more,environmental distress caused by chemistry is reduced.

作者: Libbert Peng Bing Liu Yong Gong Shumin Wang

作者单位: Anji Microelectronics (Shanghai) Co,.Ltd.,No.3000 Longdong Ave,Pudong,Shanghai,201203,China

会议类型: 国际会议

会议名称: 9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)

会议地点: 北京

会议语种:英文

页码: 1238-1241

在线出版日期: 2008-10-20（万方平台首次上网日期，不代表论文的发表时间）